Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12755801Application Date: 2010-04-07
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Publication No.: US08026518B2Publication Date: 2011-09-27
- Inventor: Chiho Kokubo , Hirokazu Yamagata , Shunpei Yamazaki
- Applicant: Chiho Kokubo , Hirokazu Yamagata , Shunpei Yamazaki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co. Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co. Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP11-135062 19990514
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
There is disclosed a semiconductor device and a method of fabricating the semiconductor device in which a heat treatment time required for crystal growth is shortened and a process is simplified. Two catalytic element introduction regions are arranged at both sides of one active layer and crystallization is made. A boundary portion where crystal growth from one catalytic element introduction region meets crystal growth from the other catalytic element introduction region is formed in a region which becomes a source region or drain region.
Public/Granted literature
- US20100195012A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2010-08-05
Information query
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