Invention Grant
US08026537B2 Semiconductor integrated circuit having an oblique global signal wiring and semiconductor integrated circuit wiring method
有权
具有倾斜全局信号布线和半导体集成电路布线方法的半导体集成电路
- Patent Title: Semiconductor integrated circuit having an oblique global signal wiring and semiconductor integrated circuit wiring method
- Patent Title (中): 具有倾斜全局信号布线和半导体集成电路布线方法的半导体集成电路
-
Application No.: US11763432Application Date: 2007-06-14
-
Publication No.: US08026537B2Publication Date: 2011-09-27
- Inventor: Naohito Kojima , Fumihiro Minami , Kimiyoshi Usami
- Applicant: Naohito Kojima , Fumihiro Minami , Kimiyoshi Usami
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP (US)
- Priority: JPP2003-011631 20030120
- Main IPC: H01L27/10
- IPC: H01L27/10
Abstract:
A semiconductor integrated circuit includes a function block arranged on a substrate, a first buffering cell arranged adjacent to a first side of the function block, a second buffering cell arranged adjacent to a second side adjacent to the first side of the function block, and signal wiring passing over the function block obliquely relative to the first side and the second side, connecting the first buffering cell and the second buffering cell.
Public/Granted literature
Information query
IPC分类:
