Invention Grant
US08026554B2 Semiconductor device and manufacturing method thereof 有权
半导体装置及其制造方法

  • Patent Title: Semiconductor device and manufacturing method thereof
  • Patent Title (中): 半导体装置及其制造方法
  • Application No.: US12279379
    Application Date: 2006-11-24
  • Publication No.: US08026554B2
    Publication Date: 2011-09-27
  • Inventor: Kenzo Manabe
  • Applicant: Kenzo Manabe
  • Applicant Address: JP Kanagawa
  • Assignee: Renesas Electronics Corporation
  • Current Assignee: Renesas Electronics Corporation
  • Current Assignee Address: JP Kanagawa
  • Agency: Young & Thompson
  • Priority: JP2006-036669 20060214; JP2006-256953 20060922
  • International Application: PCT/JP2006/323437 WO 20061124
  • International Announcement: WO2007/094110 WO 20070823
  • Main IPC: H01L27/092
  • IPC: H01L27/092
Semiconductor device and manufacturing method thereof
Abstract:
A semiconductor device includes: a silicon substrate; and a field effect transistor including a gate insulating film over the silicon substrate, a gate electrode on the gate insulating film, and source and drain regions. The gate electrode includes, in part in contact with the gate insulating film, a crystallized Ni silicide region containing an impurity element of a conductivity type opposite to a conductivity type of a channel region in the field effect transistor.
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