Invention Grant
- Patent Title: Thermoelectric cooler for semiconductor devices with TSV
- Patent Title (中): 具有TSV的半导体器件的热电冷却器
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Application No.: US12341732Application Date: 2008-12-22
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Publication No.: US08026567B2Publication Date: 2011-09-27
- Inventor: Shih-Cheng Chang , Hsin-Yu Pan
- Applicant: Shih-Cheng Chang , Hsin-Yu Pan
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufactuirng Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufactuirng Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: K&L Gates LLP
- Main IPC: H01L35/30
- IPC: H01L35/30 ; H01L23/38 ; H01L35/16 ; H01L35/26 ; H01L23/373 ; H01L29/06 ; H01L23/522
Abstract:
A thermoelectric structure for cooling an integrated circuit (IC) chip comprises a first type superlattice layer formed on top of the IC chip connected to a first voltage, and a second type superlattice layer formed on the bottom of the IC chip connected to a second voltage, the second voltage being different from the first voltage, wherein an power supply current flows through the first and second type superlattice layer for cooling the IC chip.
Public/Granted literature
- US20100155700A1 Thermoelectric Cooler for Semiconductor Devices with TSV Public/Granted day:2010-06-24
Information query
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