Invention Grant
US08026582B2 Integrated circuit package system with internal stacking module adhesive
有权
集成电路封装系统，具有内部堆叠模块粘合剂
- Patent Title: Integrated circuit package system with internal stacking module adhesive
- Patent Title (中): 集成电路封装系统，具有内部堆叠模块粘合剂
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Application No.: US12025745Application Date: 2008-02-04
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Publication No.: US08026582B2Publication Date: 2011-09-27
- Inventor: Myung Kil Lee , Jae Chang Kim , Koo Hong Lee
- Applicant: Myung Kil Lee , Jae Chang Kim , Byung Ok Kim, legal representative , Koo Hong Lee
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L23/02 ; H01L23/52
Abstract:
An integrated circuit package system comprising: providing a substrate; forming a base assembled package over the substrate; forming a top package over the base assemble package; and applying a top package stacking material for stand-off or insulation to the base assembled package and the top package.
Public/Granted literature
- US20090194867A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE ADHESIVE Public/Granted day:2009-08-06
Information query
IPC分类:
