Invention Grant
- Patent Title: Die package and method of manufacturing the same
- Patent Title (中): 模具包装及其制造方法
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Application No.: US12581131Application Date: 2009-10-17
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Publication No.: US08026590B2Publication Date: 2011-09-27
- Inventor: Joon Seok Kang , Young Ho Kim , Young Do Kweon , Jin Gu Kim , Sung Yi
- Applicant: Joon Seok Kang , Young Ho Kim , Young Do Kweon , Jin Gu Kim , Sung Yi
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Blakely, Sokoloff, Taylor & Zafman, LLP
- Priority: KR10-2009-0076744 20090819
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L21/58
Abstract:
Disclosed herein are a die package and a method of manufacturing the die package. A solder layer is formed on a lower surface of a die. The die is self-aligned and attached to a support plate using surface tension between the solder layer and a metal layer of the support plate, thus reducing attachment lead time of the die.
Public/Granted literature
- US20110042799A1 DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-02-24
Information query
IPC分类:
