Invention Grant
US08026591B2 Semiconductor device with lead terminals having portions thereof extending obliquely
有权
具有引线端子的半导体器件，其部分倾斜地延伸
- Patent Title: Semiconductor device with lead terminals having portions thereof extending obliquely
- Patent Title (中): 具有引线端子的半导体器件，其部分倾斜地延伸
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Application No.: US12659733Application Date: 2010-03-19
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Publication No.: US08026591B2Publication Date: 2011-09-27
- Inventor: Kazutaka Shibata
- Applicant: Kazutaka Shibata
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2000-307377 20001006
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/28 ; H01L23/495 ; H01L23/31
Abstract:
A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconductor chip, and hanging lead portions supporting the supporting portion. Each of the lead terminal portions adjacent to the hanging lead portion is a chamfered lead terminal portion having, at its head, a chamfered portion formed substantially in parallel with the hanging lead portion so as to avoid interference with the hanging lead portion.
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Information query
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