Invention Grant
US08026593B2 Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof
有权
具有用于焊盘的保护导电层的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof
- Patent Title (中): 具有用于焊盘的保护导电层的集成电路封装系统及其制造方法
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Application No.: US11694907Application Date: 2007-03-30
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Publication No.: US08026593B2Publication Date: 2011-09-27
- Inventor: Yaojian Lin , Haijing Cao , Qing Zhang
- Applicant: Yaojian Lin , Haijing Cao , Qing Zhang
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
An integrated circuit package system is provided including providing an integrated circuit die having a contact pad, forming a protection cover over the contact pad, forming a passivation layer having a first opening over the protection cover with the first opening exposing the protection cover, developing a conductive layer over the passivation layer, and forming a pad opening in the protection cover for exposing the contact pad.
Public/Granted literature
- US20080237880A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTECTED CONDUCTIVE LAYERS Public/Granted day:2008-10-02
Information query
IPC分类:
