Invention Grant
- Patent Title: Thermal designs of packaged gallium nitride material devices and methods of packaging
- Patent Title (中): 包装氮化镓材料装置的热设计和包装方法
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Application No.: US11839030Application Date: 2007-08-15
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Publication No.: US08026596B2Publication Date: 2011-09-27
- Inventor: Sameer Singhal , Andrew Edwards , Chul H. Park , Quinn Martin , Isik C. Kizilyalli
- Applicant: Sameer Singhal , Andrew Edwards , Chul H. Park , Quinn Martin , Isik C. Kizilyalli
- Applicant Address: US CA El Segundo
- Assignee: International Rectifier Corporation
- Current Assignee: International Rectifier Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Farjami & Farjami LLP
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L21/58
Abstract:
Gallium nitride material devices and methods associated with the devices are described. The devices may be designed to provide enhanced thermal conduction and reduced thermal resistance. The increased thermal conduction through and out of the gallium nitride devices enhances operability of the devices, including providing excellent RF operation, reliability, and lifetime.
Public/Granted literature
- US20100140665A1 Gallium Nitride Material Devices and Thermal Designs Thereof Public/Granted day:2010-06-10
Information query
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