Invention Grant
US08026611B2 Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
有权
堆叠的微电子封装具有彼此相邻的至少两个堆叠的微电子元件
- Patent Title: Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
- Patent Title (中): 堆叠的微电子封装具有彼此相邻的至少两个堆叠的微电子元件
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Application No.: US11291398Application Date: 2005-12-01
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Publication No.: US08026611B2Publication Date: 2011-09-27
- Inventor: Ilyas Mohammed , Belgacem Haba
- Applicant: Ilyas Mohammed , Belgacem Haba
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A microelectronic assembly including a first and second microelectronic elements. Each of the microelectronic elements have oppositely-facing first and second surfaces and edges bounding the surfaces. The first microelectronic element is disposed on the second microelectronic element with the second surface of the first microelectronic element facing toward the first surface of the second microelectronic element. The first microelectronic element preferably extends beyond at least one edge of the second microelectronic element and the second microelectronic element preferably extends beyond at least one edge of the first microelectronic element.
Public/Granted literature
- US20070126102A1 Stacked microelectronic packages Public/Granted day:2007-06-07
Information query
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