Invention Grant
- Patent Title: Electric circuit device enabling impedance reduction
- Patent Title (中): 电路装置可实现阻抗降低
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Application No.: US12159104Application Date: 2006-11-24
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Publication No.: US08027146B2Publication Date: 2011-09-27
- Inventor: Kazuya Niki
- Applicant: Kazuya Niki
- Applicant Address: JP Moriguchi-shi, Osaka
- Assignee: SANYO Electric Co., Ltd.
- Current Assignee: SANYO Electric Co., Ltd.
- Current Assignee Address: JP Moriguchi-shi, Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2005-372844 20051226
- International Application: PCT/JP2006/323451 WO 20061124
- International Announcement: WO2007/074598 WO 20070705
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/005
Abstract:
An electric circuit device (101) comprises an electric element (100) and a substrate (200). The electric element (100) comprises a conductive plate (11, 12), a conductive plate (21 to 23), a side anode electrode (10A, 10B) connected to the conductive plate (11, 12), and a side cathode electrode (20A, 20B, 20C, 20D) connected to the conductive plate (21-23). The conductive plate (11, 12) is alternately laminated with the conductive plate (21-23). The substrate (200) includes a dielectric (201) and a conductive plate (202-205). The conductive plate (202) is connected to the side anode electrode (10A). The conductive plate (203) is connected to the side anode electrode (10B). The conductive plate (204) is connected to the side cathode electrode (20A, 20B). The conductive plate (205) is connected to the side cathode electrode (20C, 20D).
Public/Granted literature
- US20100277851A1 ELECTRIC CIRCUIT DEVICE Public/Granted day:2010-11-04
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