Invention Grant
- Patent Title: Lead frame for quad flat no-lead package
- Patent Title (中): 四边形无引线封装的引线框架
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Application No.: US12382881Application Date: 2009-03-26
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Publication No.: US08027153B2Publication Date: 2011-09-27
- Inventor: Feng-Chun Chung
- Applicant: Feng-Chun Chung
- Applicant Address: TW Taichung
- Assignee: Lingsen Precision Industries, Ltd.
- Current Assignee: Lingsen Precision Industries, Ltd.
- Current Assignee Address: TW Taichung
- Agency: Bacon & Thomas, PLLC
- Priority: TW97223707U 20081230
- Main IPC: H05K5/02
- IPC: H05K5/02
Abstract:
A lead frame for a quad flat no-lead package includes a plurality of units arranged in a matrix manner and each having four comers. Each of the corners extends outwards to define an attaching portion for attachment to a UV tape such that four sides of each of the units won't fly off when the sides are cut off.
Public/Granted literature
- US20100165596A1 Lead frame for quad flat no-lead package Public/Granted day:2010-07-01
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