Invention Grant
- Patent Title: Method of predicting substrate current in high voltage device
- Patent Title (中): 高压设备中衬底电流的预测方法
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Application No.: US12344383Application Date: 2008-12-26
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Publication No.: US08028261B2Publication Date: 2011-09-27
- Inventor: Sang-Hun Kwak
- Applicant: Sang-Hun Kwak
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Sherr & Vaughn, PLLC
- Priority: KR10-2007-0137888 20071226
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method of predicting a substrate current in a high voltage device that may accurately predict substrate current components in each of a first region, a second region, and a third region. This may be accomplished by modeling a substrate current component in a third region, in which an inconsistency may occur when a substrate current in a high voltage device is calculated, for example using BSIM3-based modeling. According to embodiments, a substrate current for a third region may be modeled by an expression with a ternary operator, and the modeled substrate current may be added to a substrate current obtained through BSIM3-based modeling.
Public/Granted literature
- US20090235211A1 METHOD OF PREDICTING SUBSTRATE CURRENT IN HIGH VOLTAGE DEVICE Public/Granted day:2009-09-17
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