Invention Grant
- Patent Title: Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
- Patent Title (中): 连接板和多层布线板，半导体封装用基板和使用连接板的半导体封装及其制造方法
-
Application No.: US11775294Application Date: 2007-07-10
-
Publication No.: US08028402B2Publication Date: 2011-10-04
- Inventor: Hidehiro Nakamura , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
- Applicant: Hidehiro Nakamura , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2001-391799 20011225; JPP2002-126594 20020426; JPP2002-230095 20020807
- Main IPC: H05K3/36
- IPC: H05K3/36 ; H01R9/00 ; H01K3/10
Abstract:
Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.
Public/Granted literature
Information query
