Invention Grant
- Patent Title: Multi-function module
- Patent Title (中): 多功能模块
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Application No.: US12818084Application Date: 2010-06-17
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Publication No.: US08028404B2Publication Date: 2011-10-04
- Inventor: Phan Hoang
- Applicant: Phan Hoang
- Applicant Address: US CA Rancho Santa Margarita
- Assignee: Virtium Technology, Inc.
- Current Assignee: Virtium Technology, Inc.
- Current Assignee Address: US CA Rancho Santa Margarita
- Agency: Blakely Sokoloff Taylor & Zafman, LLP
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/00 ; H01R43/00 ; H01R43/16 ; H01R12/00

Abstract:
An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard.
Public/Granted literature
- US20100251543A1 MULTI-FUNCTION MODULE Public/Granted day:2010-10-07
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