Invention Grant
- Patent Title: Methods of fabricating coplanar waveguide structures
- Patent Title (中): 制造共面波导结构的方法
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Application No.: US12061861Application Date: 2008-04-03
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Publication No.: US08028406B2Publication Date: 2011-10-04
- Inventor: Hanyi Ding , Essam F. Mina , Guoan Wang , Wayne H. Woods
- Applicant: Hanyi Ding , Essam F. Mina , Guoan Wang , Wayne H. Woods
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Wood, Herron & Evans, LLP
- Main IPC: H05K3/10
- IPC: H05K3/10 ; H01P11/00 ; H01P3/00

Abstract:
Methods for fabricating a coplanar waveguide structure. The method may include forming first and second ground conductors and a signal conductor in a coplanar arrangement between the first and second ground conductors, forming a first coplanar array of substantially parallel shield conductors above the signal conductor and the first and second ground conductors, and forming a second coplanar array of substantially parallel shield conductors below the signal conductor and the first and second ground conductors. The method further includes forming a first plurality of conductive bridges located laterally between the signal conductor and the first ground conductor, and forming a second plurality of conductive bridges located laterally between the signal conductor and the second ground conductor. Each of the first plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array. Each of the second plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array.
Public/Granted literature
- US20090249610A1 METHODS OF FABRICATING COPLANAR WAVEGUIDE STRUCTURES Public/Granted day:2009-10-08
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