Invention Grant
- Patent Title: Pressure sensor and method for manufacturing the same
- Patent Title (中): 压力传感器及其制造方法
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Application No.: US12219785Application Date: 2008-07-29
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Publication No.: US08028584B2Publication Date: 2011-10-04
- Inventor: Kiyoshi Otsuka , Yasuaki Makino , Tsuyoshi Fukada , Inao Toyoda , Naoki Kakoiyama
- Applicant: Kiyoshi Otsuka , Yasuaki Makino , Tsuyoshi Fukada , Inao Toyoda , Naoki Kakoiyama
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2007-213487 20070820; JP2008-063869 20080313
- Main IPC: G01L7/00
- IPC: G01L7/00

Abstract:
A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.
Public/Granted literature
- US20090049921A1 Pressure sensor and method for manufacturing the same Public/Granted day:2009-02-26
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