Invention Grant
- Patent Title: Contact-pressure adjusting method and contact-pressure adjusting system for liquid application machine
- Patent Title (中): 液体施胶机接触压力调节方法及接触压力调节系统
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Application No.: US12043020Application Date: 2008-03-05
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Publication No.: US08028623B2Publication Date: 2011-10-04
- Inventor: Akihiko Takenouchi , Hiromitsu Numauchi , Akehiro Kusaka
- Applicant: Akihiko Takenouchi , Hiromitsu Numauchi , Akehiro Kusaka
- Applicant Address: JP Tokyo
- Assignee: Komori Corporation
- Current Assignee: Komori Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-053847 20070305
- Main IPC: B41F31/32
- IPC: B41F31/32 ; B41F13/34

Abstract:
Disclosed is a contact-pressure adjusting method and a contact-pressure adjusting system, each of which automatically adjusts the contact pressure between two rotors, for a liquid application machine including: a first rotor to which liquid is supplied; a second rotor to which the liquid is supplied from the first rotor; and a contact-pressure adjusting unit for adjusting the contact pressure between the first rotor and the second rotor. By using a temperature measuring unit, measured is: the temperature of at least one of the surfaces of the first and second rotors; the temperature of at least one of the liquid on the surface of the first rotor and the liquid on the surface of the second rotor; or the temperature of at least one of the vicinity of the first rotor and the vicinity of the second rotor. The contact-pressure adjusting unit is adjusted in accordance with the measured temperature.
Public/Granted literature
- US20080216697A1 CONTACT-PRESSURE ADJUSTING METHOD AND CONTACT-PRESSURE ADJUSTING SYSTEM FOR LIQUID APPLICATION MACHINE Public/Granted day:2008-09-11
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