Invention Grant
US08028653B2 System, method and apparatus for filament and support used in plasma-enhanced chemical vapor deposition for reducing carbon voids on media disks in disk drives
有权
用于等离子体增强化学气相沉积中用于减少磁盘驱动器中介质盘上的碳空隙的灯丝和支架的系统，方法和装置
- Patent Title: System, method and apparatus for filament and support used in plasma-enhanced chemical vapor deposition for reducing carbon voids on media disks in disk drives
- Patent Title (中): 用于等离子体增强化学气相沉积中用于减少磁盘驱动器中介质盘上的碳空隙的灯丝和支架的系统，方法和装置
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Application No.: US11951649Application Date: 2007-12-06
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Publication No.: US08028653B2Publication Date: 2011-10-04
- Inventor: Eric Hwang , Jinliu Wang , Richard Longstreth White
- Applicant: Eric Hwang , Jinliu Wang , Richard Longstreth White
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
- Current Assignee Address: NL Amsterdam
- Main IPC: C23C16/00
- IPC: C23C16/00 ; A21B1/00 ; A21B1/22 ; H05B1/02 ; H01G5/01 ; H01G5/38 ; H01G5/06 ; H01G4/228 ; H01G9/10 ; H02B1/00 ; H01R9/00 ; H05K5/03
Abstract:
A filament post used in plasma-enhanced chemical vapor deposition has an outer shell and an inner post. An electrical potential is applied only to the inner post to ensure that there is no impact on the plasma density and the carbon film properties. The inner post and the outer shell are electrically insulated by ceramic insulators, such that no electrical potential is applied to outer shell. The stress generated in the carbon film is directly related to the electrical potential of the surface to which the film is deposited. The carbon film deposited on the outer shell of the post is not highly stressed, which significantly reduces film delamination from the filament post surfaces.
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