A system for passively cooling an electronic component includes a conduit configured to carry a pressurized cooling fluid. The conduit has a plurality of delivery orifices configured to dispense the pressurized cooling fluid from the conduit to cool the electronic component. Each delivery orifice has a hydrogel mechanism associated therewith, which is configured to individually control each of the plurality of delivery orifices to automatically regulate flow of the cooling fluid in response to a variation in a property of an ambient environment surrounding the hydrogel mechanism. The property of the ambient environment is influenced by an operation of the electronic component.