A heat sink system with reduced airborne debris clogging, for cooling power electronics, the heat sink system including a heat sink having a plurality of fins, a housing configured to direct air flow around the side, top, and/or bottom of the heat sink and then through the fins of the heat sink at a back of the heat sink, and an inlet airway passage formed between a wall of the housing and said side, top, and/or bottom of the finned heat sink to allow air to pass within the housing, wherein said side, top, and/or bottom of the heat sink comprises at least one of said plurality of fins disposed directly in contact with the inlet airway passage.