Invention Grant
- Patent Title: Wafer handling system
- Patent Title (中): 晶圆处理系统
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Application No.: US10397946Application Date: 2003-03-25
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Publication No.: US08028978B2Publication Date: 2011-10-04
- Inventor: Gordon R. Nelson , Jeffry A. Davis , Raymon F. Thompson , Eric J. Bergman
- Applicant: Gordon R. Nelson , Jeffry A. Davis , Raymon F. Thompson , Eric J. Bergman
- Applicant Address: US MT Kalispell
- Assignee: Semitool, Inc.
- Current Assignee: Semitool, Inc.
- Current Assignee Address: US MT Kalispell
- Agency: Perkins Coie LLP
- Agent Kenneth H. Ohriner
- Main IPC: B23P19/00
- IPC: B23P19/00
Abstract:
A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.
Public/Granted literature
- US20030188447A1 Wafer handling system Public/Granted day:2003-10-09
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