Invention Grant
- Patent Title: Resin seal ring and manufacturing method
- Patent Title (中): 树脂密封圈及其制造方法
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Application No.: US12455611Application Date: 2009-06-04
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Publication No.: US08028997B2Publication Date: 2011-10-04
- Inventor: Eiichirou Shimazu , Keitarou Emura , Masaki Egami
- Applicant: Eiichirou Shimazu , Keitarou Emura , Masaki Egami
- Applicant Address: JP Osaka
- Assignee: NTN Corporation
- Current Assignee: NTN Corporation
- Current Assignee Address: JP Osaka
- Agency: Hedman & Costigan, P.C.
- Agent James V. Costigan
- Priority: JPP2003-152219 20030529; JPP2003-420450 20031218
- Main IPC: B60T11/236
- IPC: B60T11/236 ; B29B7/00
Abstract:
The present invention provides a seal ring which can be prevented from being broken by an expansion and a shock applied thereto when the seal ring is fitted on a rotary shaft and does not have a configurative disadvantage such as a burr. Therefore no post-processing is required. The present invention also provides materials of the seal ring and a method of manufacturing the seal ring. The seal ring is made of resin and having two abutments confronting each other and a gate mark formed in an injection molding operation.
Public/Granted literature
- US20090243224A1 Resin seal ring and manufacturing method Public/Granted day:2009-10-01
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