Invention Grant
- Patent Title: Computer housing and flattenable frame for the computer housing
- Patent Title (中): 电脑外壳和电脑外壳可压扁框架
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Application No.: US11761092Application Date: 2007-06-11
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Publication No.: US08029077B2Publication Date: 2011-10-04
- Inventor: Sheng-Hsiung Cheng , Te-An Lin , Wu-Nan Wang , Chia-Chia Huang
- Applicant: Sheng-Hsiung Cheng , Te-An Lin , Wu-Nan Wang , Chia-Chia Huang
- Applicant Address: TW Taipei Hsien
- Assignee: Aopen Inc.
- Current Assignee: Aopen Inc.
- Current Assignee Address: TW Taipei Hsien
- Agency: Foley & Lardner LLP
- Agent Stephen A. Bent
- Priority: TW95211543U 20060630
- Main IPC: A47B43/00
- IPC: A47B43/00

Abstract:
A computer housing includes a frame and a face panel. The frame includes a plurality of pivotally interconnected frame panels such that the frame is convertible between an assembled state and a flattened state. In the assembled state, the frame panels form a rectangular frame for mounting electronic components, such as a motherboard, a disk drive and a hard disk. In the flattened state, the frame can be flattened out so that the frame panels lie in substantially the same plane, thereby reducing the space occupied by the frame.
Public/Granted literature
- US20080002349A1 COMPUTER HOUSING AND FLATTENABLE FRAME FOR THE COMPUTER HOUSING Public/Granted day:2008-01-03
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