Invention Grant
- Patent Title: Stacked process modules for a semiconductor handling system
- Patent Title (中): 用于半导体处理系统的堆叠过程模块
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Application No.: US12206382Application Date: 2008-09-08
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Publication No.: US08029225B2Publication Date: 2011-10-04
- Inventor: Peter van der Meulen
- Applicant: Peter van der Meulen
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation, Inc.
- Current Assignee: Brooks Automation, Inc.
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Agent Richard Pickreign
- Main IPC: B65G49/07
- IPC: B65G49/07
Abstract:
Methods and systems are provided for a vacuum-based semiconductor handling system. The system may be a linear system with a four-link robotic SCARA arm for moving materials in the system. The system may include one or more vertically stacked load locks or vertically stacked process modules.
Public/Granted literature
- US20090067958A1 STACKED PROCESS MODULES FOR A SEMICONDUCTOR HANDLING SYSTEM Public/Granted day:2009-03-12
Information query
IPC分类:
