Invention Grant
- Patent Title: Ejector apparatus
- Patent Title (中): 喷射装置
-
Application No.: US12599046Application Date: 2008-05-19
-
Publication No.: US08029267B2Publication Date: 2011-10-04
- Inventor: Hiroshi Takao
- Applicant: Hiroshi Takao
- Applicant Address: JP Chiba
- Assignee: Takao Injection Mold Engineering Co., Ltd.
- Current Assignee: Takao Injection Mold Engineering Co., Ltd.
- Current Assignee Address: JP Chiba
- Agency: Osha • Liang LLP
- Priority: JP2007-003571U 20070517
- International Application: PCT/JP2008/059135 WO 20080519
- International Announcement: WO2008/143214 WO 20081127
- Main IPC: B29C45/44
- IPC: B29C45/44

Abstract:
An ejector apparatus moves a lift core extending through a core of a component of a resin molding mold to form an undercut portion in a molded piece and is installed so as to be capable of moving obliquely with respect to the core surface in a longitudinal direction. An ejector plate is arranged between the core and a base plate below the core, so as to be capable of moving up and down. A slide path is formed in the ejector plate extending in a direction in which a lower end of the lift core makes relative horizontal movement during ascent and descent of the lift core. A slide base is movably arranged in the slide path and coupled to the lower end of the lift core. A guide rod imparts a moving force within the slide path to the lower end of the lift core during ascent and descent of the ejector plate.
Public/Granted literature
- US20100221379A1 EJECTOR APPARATUS Public/Granted day:2010-09-02
Information query