Invention Grant
- Patent Title: Connection unit and mounting process for such a connection unit
- Patent Title (中): 这种连接单元的连接单元和安装过程
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Application No.: US12503509Application Date: 2009-07-15
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Publication No.: US08029325B2Publication Date: 2011-10-04
- Inventor: Laurent Bardet
- Applicant: Laurent Bardet
- Applicant Address: FR Versailles
- Assignee: Souriau
- Current Assignee: Souriau
- Current Assignee Address: FR Versailles
- Agency: Im IP Law PLLC
- Agent C. Andrew Im
- Priority: FR0854807 20080715
- Main IPC: H01R13/514
- IPC: H01R13/514

Abstract:
The invention relates a connection unit comprising an insert provided a front part and a back part provided with longitudinal through holes. At least one longitudinal through hole in the front part of the insert coincides with a longitudinal through hole in the back part. The connection unit includes at least one contact extending through a longitudinal through hole in the front part and through a longitudinal through hole in the back part of the insert. A front portion of the contact is provided with a stop pressing on a stop in the longitudinal hole in the front part of the insert. A back portion of said contact is provided with retaining means which require said back portion be forced into the longitudinal hole in the back part of the insert. The invention also relates a mounting process of such a connection unit, as well as a connection kit.
Public/Granted literature
- US20100029137A1 Connection unit and mounting process for such a connection unit Public/Granted day:2010-02-04
Information query