Invention Grant
- Patent Title: Substrate processing apparatus, liquid film freezing method and substrate processing method
- Patent Title (中): 基板处理装置,液膜冷冻法和基板处理方法
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Application No.: US11837575Application Date: 2007-08-13
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Publication No.: US08029622B2Publication Date: 2011-10-04
- Inventor: Katsuhiko Miya , Naozumi Fujiwara , Akira Izumi
- Applicant: Katsuhiko Miya , Naozumi Fujiwara , Akira Izumi
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostolenk Faber LLP
- Priority: JP2006-248181 20060913
- Main IPC: B08B5/00
- IPC: B08B5/00

Abstract:
A cooling gas is discharged from a cooling gas discharge nozzle toward a local section of a front surface of a substrate on which a liquid film is formed. And then the cooling gas discharge nozzle moves from a rotational center position of the substrate toward an edge position of the substrate along a moving trajectory while the substrate is rotated. As a result, of the surface region of the front surface of the substrate, an area where the liquid film has been frozen (frozen area) expands toward the periphery edge from the center of the front surface of the substrate. It is therefore possible to form a frozen film all over the front surface of the substrate while suppressing deterioration of the durability of the substrate peripheral members since a section receiving supply of the cooling gas is limited to a local area on the front surface of the substrate.
Public/Granted literature
- US20080060686A1 SUBSTRATE PROCESSING APPARATUS, LIQUID FILM FREEZING METHOD AND SUBSTRATE PROCESSING METHOD Public/Granted day:2008-03-13
Information query
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