Invention Grant
- Patent Title: Mixed conductive powder and use thereof
- Patent Title (中): 混合导电粉末及其用途
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Application No.: US12872838Application Date: 2010-08-31
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Publication No.: US08029701B2Publication Date: 2011-10-04
- Inventor: Hideji Kuwajima
- Applicant: Hideji Kuwajima
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2003-335181 20030926; JPP2003-335211 20030926; JPP2004-067152 20040310
- Main IPC: H01B1/20
- IPC: H01B1/20 ; H01B1/00

Abstract:
There are disclosed a highly packed, mixed conductive powder with a relative packing density of at least 68%, a process for producing the same, a conductive paste using the mixed conductive powder and a process for producing the same, as well as a sheet and a sheet with attached film using the mixed conductive powder. This mixed conductive powder comprises substantially monodispersed conductive scale-like particles (A1) and conductive substantially spherical particles (B1). Or, this mixed conductive powder comprises substantially monodispersed, conductive, substantially spherical particles (A2) and conductive substantially spherical particles (B2) with a smaller particle diameter than that of the substantially spherical particles (A2).
Public/Granted literature
- US20100323198A1 MIXED CONDUCTIVE POWDER AND USE THEREOF Public/Granted day:2010-12-23
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