Invention Grant
US08029708B2 Methods of cutting or forming cavities in a substrate for use in making optical films, components or wave guides
有权
在用于制造光学膜，部件或波导的基板中切割或形成空腔的方法
- Patent Title: Methods of cutting or forming cavities in a substrate for use in making optical films, components or wave guides
- Patent Title (中): 在用于制造光学膜，部件或波导的基板中切割或形成空腔的方法
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Application No.: US12487726Application Date: 2009-06-19
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Publication No.: US08029708B2Publication Date: 2011-10-04
- Inventor: Jeffery R. Parker , Timothy A. McCollum , Robert M. Ezell , Kurt R. Starkey
- Applicant: Jeffery R. Parker , Timothy A. McCollum , Robert M. Ezell , Kurt R. Starkey
- Applicant Address: KY
- Assignee: Rambus International Ltd.
- Current Assignee: Rambus International Ltd.
- Current Assignee Address: KY
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Main IPC: B29D11/00
- IPC: B29D11/00
Abstract:
A method of forming a varying pattern of optical elements on or in at least one side of an optical panel member involves cutting or forming a pattern or patterns of cavities in a cylindrical or curved substrate or in a sleeve or sleeve segment of the substrate that corresponds to a desired pattern and shape of optical elements to be formed on or in the optical member. The substrate or sleeve or sleeve segment containing the desired pattern or patterns of optical element shaped cavities or depositions or mirror copies or inverse copies thereof is used in production tooling or as a master for production tooling to form the corresponding pattern of optical elements on or in at least the one side of the optical panel member.
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