Invention Grant
- Patent Title: Method of molding footwear components
- Patent Title (中): 成型鞋类组件的方法
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Application No.: US12474718Application Date: 2009-05-29
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Publication No.: US08029721B2Publication Date: 2011-10-04
- Inventor: Todd A. Waatti
- Applicant: Todd A. Waatti
- Applicant Address: US OR Beaverton
- Assignee: NIKE, Inc.
- Current Assignee: NIKE, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Banner & Witcoff, Ltd.
- Main IPC: B29B7/00
- IPC: B29B7/00 ; B29C45/00 ; B29C45/73 ; B29C35/02 ; B29D35/00 ; A01J21/00 ; A01J25/12 ; A21C11/00

Abstract:
Mold assemblies for compression molding of footwear components include molds, heating elements, conductor plates, insulating layers and carrier trays. An upper mold assembly is placed into a fixture attached to an upper press platen. A lower mold assembly slides into and out of a fixture attached to a lower press platen. Heating elements within the mold assemblies connect to electrical contacts in the fixtures when the mold assemblies are installed in the fixtures, thereby providing electrical power to the heating elements and heating the molds. A conveyor is positioned to receive a mold assembly from (or transfer a mold assembly to) the lower press platen fixture when the lower platen is in a lowered position.
Public/Granted literature
- US20090250843A1 Footwear Mold Heating System and Method Public/Granted day:2009-10-08
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