Invention Grant
- Patent Title: Thermal interface material and method for manufacturing same
- Patent Title (中): 热界面材料及其制造方法
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Application No.: US11478920Application Date: 2006-06-30
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Publication No.: US08029900B2Publication Date: 2011-10-04
- Inventor: Yang Wu , Hua Huang , Chang-Hong Liu , Shou-Shan Fan
- Applicant: Yang Wu , Hua Huang , Chang-Hong Liu , Shou-Shan Fan
- Applicant Address: CN Beijing TW Tu-Cheng, New Taipei
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200510035752 20050701
- Main IPC: B32B9/00
- IPC: B32B9/00

Abstract:
One embodiment of a thermal interface material includes a plurality of carbon nanotubes each having a first end and an opposite second end, a heat current collector covering one of the first ends and the second ends of the carbon nanotubes, and a macromolecular material filled in spaces between the carbon nanotubes and heat current collector. A method for manufacturing a thermal interface material is also provided.
Public/Granted literature
- US20100243227A1 Thermal interface material and method for manufacturing same Public/Granted day:2010-09-30
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