Invention Grant
- Patent Title: Lithographic method and carrier substrate
- Patent Title (中): 平版印刷法和载体基片
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Application No.: US12276705Application Date: 2008-11-24
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Publication No.: US08029973B2Publication Date: 2011-10-04
- Inventor: Wilhelmus Johannes Maria De Laat , Cheng-Qun Gui , Peter Theodorus Maria Giesen , Paulus Wilhelmus Leonardus Van Dijk , Erwin Rinaldo Meinders , Maria Peter
- Applicant: Wilhelmus Johannes Maria De Laat , Cheng-Qun Gui , Peter Theodorus Maria Giesen , Paulus Wilhelmus Leonardus Van Dijk , Erwin Rinaldo Meinders , Maria Peter
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/09
Abstract:
A carrier substrate is provided with a layer of PDMS and curing agent on one side of the carrier substrate. The PDMS and curing agent can be arranged to receive and adhere to a lithographic substrate. The carrier substrate can be dimensioned such that the combined carrier substrate and lithographic substrate may be handled by a conventional lithographic apparatus.
Public/Granted literature
- US20090170025A1 LITHOGRAPHIC METHOD AND CARRIER SUBSTRATE Public/Granted day:2009-07-02
Information query
