Invention Grant
- Patent Title: Semiconductor module
- Patent Title (中): 半导体模块
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Application No.: US12403035Application Date: 2009-03-12
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Publication No.: US08030131B2Publication Date: 2011-10-04
- Inventor: Ralf Otremba , Xaver Schloegel , Klaus Schiess , Tien Lai Tan
- Applicant: Ralf Otremba , Xaver Schloegel , Klaus Schiess , Tien Lai Tan
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier.
Public/Granted literature
- US20090227071A1 SEMICONDUCTOR MODULE Public/Granted day:2009-09-10
Information query
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