Invention Grant
- Patent Title: SOI substrate and manufacturing method thereof
- Patent Title (中): SOI衬底及其制造方法
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Application No.: US12497720Application Date: 2009-07-06
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Publication No.: US08030169B2Publication Date: 2011-10-04
- Inventor: Tetsuya Kakehata , Hideto Ohnuma , Yoshiaki Yamamoto , Kenichiro Makino
- Applicant: Tetsuya Kakehata , Hideto Ohnuma , Yoshiaki Yamamoto , Kenichiro Makino
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2008-178027 20080708
- Main IPC: H01L21/762
- IPC: H01L21/762

Abstract:
An object is to provide an SOI substrate provided with a semiconductor layer which can be used practically even when a glass substrate is used as a base substrate. Another object is to provide a semiconductor device having high reliability using such an SOI substrate. An altered layer is formed on at least one surface of a glass substrate used as a base substrate of an SOI substrate to form the SOI substrate. The altered layer is formed on at least the one surface of the glass substrate by cleaning the glass substrate with solution including hydrochloric acid, sulfuric acid or nitric acid. The altered layer has a higher proportion of silicon oxide in its composition and a lower density than the glass substrate.
Public/Granted literature
- US20100006940A1 SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-01-14
Information query
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