Invention Grant
- Patent Title: Method of fabricating semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US11955496Application Date: 2007-12-13
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Publication No.: US08030193B2Publication Date: 2011-10-04
- Inventor: Atsuo Isobe , Suguru Ozawa
- Applicant: Atsuo Isobe , Suguru Ozawa
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2006-338012 20061215
- Main IPC: H01L21/28
- IPC: H01L21/28

Abstract:
To fabricate a Schottky barrier diode in which a decrease in on current due to parasitic resistance is suppressed, variations in on current are suppressed, and an increase in off current is suppressed. The fabricating method includes the steps of forming an island-shape semiconductor film; doping the island-shape semiconductor film with a first impurity element to form a first impurity region; forming an insulating film so as to cover the island-shape semiconductor film; etching the insulating film to form a first opening and a second opening that partly expose the first impurity region; forming a mask over the insulating film so as to cover the first opening and expose the second opening; doping the first impurity region with a second impurity element to form a second impurity region; and forming a first wiring in contact with the first impurity region exposed at the first opening, and forming a second wiring in contact with the second impurity region exposed at the second opening. Since the second impurity element is added through the second opening, the periphery of the second opening is also doped with a slight amount of the second impurity element. Therefore, the first impurity region and the second wiring are located away a short distance from each other such that they are not shorted.
Public/Granted literature
- US20080142921A1 METHOD OF FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2008-06-19
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