Invention Grant
- Patent Title: Low resistance splice for high temperature superconductor wires
- Patent Title (中): 低电阻接头用于高温超导线
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Application No.: US11880586Application Date: 2007-07-23
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Publication No.: US08030246B2Publication Date: 2011-10-04
- Inventor: Alexander Otto , Eric R. Podtburg
- Applicant: Alexander Otto , Eric R. Podtburg
- Applicant Address: US MA Devens
- Assignee: American Superconductor Corporation
- Current Assignee: American Superconductor Corporation
- Current Assignee Address: US MA Devens
- Agency: Occhiuti Rohlicek & Tsao LLP
- Main IPC: H01L39/24
- IPC: H01L39/24

Abstract:
Under one aspect, a laminated, spliced superconductor wire includes a superconductor joint, which includes (i) first and second superconductor wires, each wire including a substrate, a superconductor layer overlying the substrate, and a cap layer overlying the superconductor layer; and (ii) a conductive bridge, the conductive bridge including a substrate, a superconductor layer overlying the substrate, and a cap layer overlying the superconductor layer, wherein the cap layer of the conductive bridge is in electrically conductive contact with a portion of the cap layer of each of the first and second superconductor wires through an electrically conductive bonding material. The spliced wire also includes (b) a stabilizer structure surrounding at least a portion of the superconductor joint, wherein the superconductor joint is in electrical contact with the stabilizer structure; and (c) a substantially nonporous electrically conductive filler, wherein the filler substantially surrounds the superconductor joint.
Public/Granted literature
- US20090298696A1 Low resistance splice for high temperature superconductor wires Public/Granted day:2009-12-03
Information query
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