Invention Grant
- Patent Title: Heat curing silicone rubber compound composition
- Patent Title (中): 热固化硅橡胶复合组成
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Application No.: US12735084Application Date: 2008-12-26
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Publication No.: US08030378B2Publication Date: 2011-10-04
- Inventor: Hiroyoshi Iijima
- Applicant: Hiroyoshi Iijima
- Applicant Address: JP Tokyo
- Assignee: Momentive Performance Materials Japan LLC
- Current Assignee: Momentive Performance Materials Japan LLC
- Current Assignee Address: JP Tokyo
- Agency: Flynn, Thiel, Boutell & Tanis, P.C.
- Priority: JP2007-335682 20071227
- International Application: PCT/JP2008/073970 WO 20081226
- International Announcement: WO2009/084733 WO 20090709
- Main IPC: C08K5/34
- IPC: C08K5/34 ; C08K5/3412 ; C08K5/3415 ; C08K5/43 ; C08K3/36

Abstract:
The present invention provides a silica-containing heat curing silicone rubber compound composition which can be produced safely and hardly suffers from inclusion of foreign substances. More specifically, when (A) 100 parts by weight of a polyorganosiloxane base polymer and (B) 1 to 100 parts by weight of a reinforcing silica are mixed together, (C) 0.05 to 80 ppm of an ionic liquid whose anionic component is bis(trifluoromethanesulfonyl)imide is added thereto.
Public/Granted literature
- US20110118392A1 HEAT CURING SILICONE RUBBER COMPOUND COMPOSITION Public/Granted day:2011-05-19
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