Invention Grant
- Patent Title: Flexible printed circuit
- Patent Title (中): 柔性印刷电路
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Application No.: US12150265Application Date: 2008-04-25
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Publication No.: US08030574B2Publication Date: 2011-10-04
- Inventor: Wen-Bin Lin , Chih-Hung Chang
- Applicant: Wen-Bin Lin , Chih-Hung Chang
- Applicant Address: CN Shenzhen, Guangdong Province TW Miao-Li County
- Assignee: Innocom Technology (Shenzhen) Co., Ltd.,Chimei Innolux Corporation
- Current Assignee: Innocom Technology (Shenzhen) Co., Ltd.,Chimei Innolux Corporation
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Miao-Li County
- Agency: Altis Law Group, Inc.
- Priority: CN200710074217 20070425
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A flexible printed circuit includes a flexible substrate, a plurality of first conductive wires, and a plurality of second conductive wires. The flexible substrate includes a first surface and a second surface facing the first surface. The first conductive wires are provided on the first surface. The first conductive wires extend from an edge of the flexible substrate to another edge of the flexible substrate. The second conductive wires are provided on the second surface. The second conductive wires extend from an end of the flexible substrate to a predetermined portion of the flexible substrate. A part of each second conductive wire at the predetermined portion of the flexible substrate is electrically connected with the first conductive wire via a conductive structure.
Public/Granted literature
- US20080277145A1 Flexible printed circuit Public/Granted day:2008-11-13
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