Invention Grant
- Patent Title: Wired circuit board with interposed metal thin film and producing method thereof
- Patent Title (中): 带金属薄膜的有线电路板及其制造方法
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Application No.: US12073193Application Date: 2008-03-03
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Publication No.: US08030576B2Publication Date: 2011-10-04
- Inventor: Katsutoshi Kamei , Takahiko Yokai , Visit Thaveeprungsriporn
- Applicant: Katsutoshi Kamei , Takahiko Yokai , Visit Thaveeprungsriporn
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2007-054339 20070305
- Main IPC: H05K1/03
- IPC: H05K1/03 ; G11B5/48 ; G11B21/16
Abstract:
A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin film including a protecting portion interposed between the wire and the insulating cover layer, and an exposed portion formed continuously from the protecting portion on a peripheral end portion of the terminal portion exposed from the opening portion.
Public/Granted literature
- US20080217048A1 Wired circuit board and producing method thereof Public/Granted day:2008-09-11
Information query
