Invention Grant
- Patent Title: Printed wiring board and method for producing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US12146105Application Date: 2008-06-25
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Publication No.: US08030577B2Publication Date: 2011-10-04
- Inventor: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- Applicant: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP10-272799 19980928; JP10-276010 19980929; JP10-276011 19980929; JP10-290450 19981013; JP10-310445 19981030; JP10-351572 19981210; JP10-354733 19981214; JP10-372274 19981228; JP11-106184 19990414; JP11-187418 19990701
- Main IPC: H05K1/09
- IPC: H05K1/09
Abstract:
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
Public/Granted literature
- US20080289864A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME Public/Granted day:2008-11-27
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