A side key module installed at a side of a mobile communication terminal, contactly coupled up to a PCB embedded in the terminal, and simply fabricated without a soldering process. The side key module disposed between a side key installed at the side of the terminal, and the PCB installed in the terminal, including: a first plate of conductivity configured in a lengthwise form including a cut-out space and contacting with the PCB; a second plate of conductivity configured in the same plane with the first plate and disposed in the cut-out space of the first plate, contacting with the PCB; a body accommodating the first and second plates; and a metal dome joining with a side of the body and enabling the first and second plates to be electrically connected together by contacting with the first and second plates if the side key is pressed.