Invention Grant
- Patent Title: Optical semiconductor device module having leaf springs with different rectangularly-shaped terminals
- Patent Title (中): 具有不同矩形端子的板簧的光学半导体器件模块
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Application No.: US12506651Application Date: 2009-07-21
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Publication No.: US08030678B2Publication Date: 2011-10-04
- Inventor: Takaaki Sakai , Kazuhiko Ueno
- Applicant: Takaaki Sakai , Kazuhiko Ueno
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2008-189498 20080723
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
In an optical semiconductor device module constructed by an optical semiconductor device having a light emitting portion on its top surface, a mounting substrate adapted to mount the optical semiconductor device thereon, and at least one conductive leaf spring adapted to fix the optical semiconductor device to the mounting substrate and supply power to the optical semiconductor device, the leaf spring is formed by a plurality of rectangularly-shaped terminals, and natural frequencies of at least two of the rectangularly-shaped terminals are different from each other.
Public/Granted literature
- US20100025721A1 OPTICAL SEMICONDUCTOR DEVICE MODULE HAVING LEAF SPRINGS WITH DIFFERENT RECTANGULARLY-SHAPED TERMINALS Public/Granted day:2010-02-04
Information query
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