Invention Grant
- Patent Title: Power semiconductor device
- Patent Title (中): 功率半导体器件
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Application No.: US12540192Application Date: 2009-08-12
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Publication No.: US08030706B2Publication Date: 2011-10-04
- Inventor: Miho Watanabe , Masaru Izumisawa , Yasuto Sumi , Hiroshi Ohta , Wataru Sekine , Wataru Saito , Syotaro Ono , Nana Hatano
- Applicant: Miho Watanabe , Masaru Izumisawa , Yasuto Sumi , Hiroshi Ohta , Wataru Sekine , Wataru Saito , Syotaro Ono , Nana Hatano
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2008-208910 20080814
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device according to an embodiment of the present invention includes a device part and a terminal part. The device includes a first semiconductor layer, and second and third semiconductor layers formed on the first semiconductor layer, and alternately arranged along a direction parallel to a surface of the first semiconductor layer, wherein the device part is provided with a first region and a second region, each of which includes at least one of the second semiconductor layers and at least one of the third semiconductor layers, and with regard to a difference value ΔN (=NA−NB) obtained by subtracting an impurity amount NB per unit length of each of the third semiconductor layers from an impurity amount NA per unit length of each of the second semiconductor layers, a difference value ΔNC1 which is the difference value ΔN in the first region of the device part, a difference value ΔNC2 which is the difference value ΔN in the second region of the device part, and a difference value ΔNT which is the difference value ΔN in the terminal part satisfy a relationship of ΔNC1>ΔNT>ΔNC2.
Public/Granted literature
- US20100038712A1 POWER SEMICONDUCTOR DEVICE Public/Granted day:2010-02-18
Information query
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