Invention Grant
US08030726B2 Solid-state image sensor and method for manufacturing thereof as well as semiconductor device and method for manufacturing thereof 有权
固态图像传感器及其制造方法以及半导体装置及其制造方法

  • Patent Title: Solid-state image sensor and method for manufacturing thereof as well as semiconductor device and method for manufacturing thereof
  • Patent Title (中): 固态图像传感器及其制造方法以及半导体装置及其制造方法
  • Application No.: US12402195
    Application Date: 2009-03-11
  • Publication No.: US08030726B2
    Publication Date: 2011-10-04
  • Inventor: Hirofumi Sumi
  • Applicant: Hirofumi Sumi
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: K&L Gates LLP
  • Priority: JP2004-314340 20041028
  • Main IPC: H01L31/12
  • IPC: H01L31/12
Solid-state image sensor and method for manufacturing thereof as well as semiconductor device and method for manufacturing thereof
Abstract:
A solid-state image sensor and a method for manufacturing thereof and a semiconductor device and a method for manufacturing thereof are provided. A semiconductor substrate is made to be the thin film without using an SOI substrate and cost is reduced. An edge detection portion having hardness larger than that of a semiconductor substrate is formed in the thickness direction of the semiconductor substrate; the semiconductor substrate is made to be the thin film until a position where the edge detection portion is exposed by chemical mechanical polishing from the rear surface; and means Tr1 for reading out a signal from a photoelectric conversion element PD formed in the substrate are formed on the front surface of the semiconductor substrate, where incident light is acquired from the rear surface of the semiconductor substrate.
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