Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US12292480Application Date: 2008-11-20
-
Publication No.: US08030749B2Publication Date: 2011-10-04
- Inventor: Shin Soyano , Katsumichi Ueyanagi
- Applicant: Shin Soyano , Katsumichi Ueyanagi
- Applicant Address: JP Shinagawa-Ku, Tokyo
- Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee Address: JP Shinagawa-Ku, Tokyo
- Agent Manabu Kanesaka
- Priority: JP2007-313488 20071204
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor device includes a resin case, a plurality of external connection terminals fixedly provided on the resin case, and at least one semiconductor element provided in the resin case. At least one terminal block has at least one wiring terminal for electrically connecting the semiconductor element and the external connection terminals.
Public/Granted literature
- US20090140414A1 Semiconductor device Public/Granted day:2009-06-04
Information query
IPC分类:
