Invention Grant
- Patent Title: Semiconductor apparatus and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11999387Application Date: 2007-12-04
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Publication No.: US08030760B2Publication Date: 2011-10-04
- Inventor: Keiji Toh , Hidehito Kubo , Masahiko Kimbara , Haruo Takagi , Daizo Kamiyama
- Applicant: Keiji Toh , Hidehito Kubo , Masahiko Kimbara , Haruo Takagi , Daizo Kamiyama
- Applicant Address: JP Aichi-ken
- Assignee: Kabushiki Kaisha Toyota Jidoshokki
- Current Assignee: Kabushiki Kaisha Toyota Jidoshokki
- Current Assignee Address: JP Aichi-ken
- Agency: Locke Lord Bissell & Liddell LLP
- Priority: JP2006-328396 20061205; JP2007-134291 20070521
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/58
Abstract:
A semiconductor apparatus includes a semiconductor device, a cooler of a forced cooling type, and a heat mass. Heat generated in the semiconductor device is conducted to the cooler. The heat mass comes into junction with the semiconductor device with solder so as to be thermally combined with the semiconductor device. The heat mass functions also as an electrode.
Public/Granted literature
- US20080128896A1 Semiconductor apparatus and manufacturing method thereof Public/Granted day:2008-06-05
Information query
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