An IC tag label 1A includes an inlet substrate 11; an antenna pattern 2 and an IC chip 3 which are provided on one surface of the inlet substrate 11; and an adhesive layer 6 which is mounted on the other surface of the inlet substrate 11. A release paper 7 is attached to the adhesive layer 6. An opening 12 which serves as a clearance for the IC chip 3 is provided in a portion of the release paper 7 and adhesive layer 6, the portion corresponding to the IC chip 3.