Invention Grant
- Patent Title: Semiconductor memory module incorporating antenna
- Patent Title (中): 半导体存储模块内置天线
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Application No.: US12280456Application Date: 2007-03-28
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Publication No.: US08031127B2Publication Date: 2011-10-04
- Inventor: Shozo Ochi , Hidenobu Nishikawa , Hiroshi Sakurai
- Applicant: Shozo Ochi , Hidenobu Nishikawa , Hiroshi Sakurai
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-101740 20060403
- International Application: PCT/JP2007/056662 WO 20070328
- International Announcement: WO2007/116790 WO 20071018
- Main IPC: H01Q7/08
- IPC: H01Q7/08

Abstract:
The semiconductor memory module incorporating antenna includes a wiring board (11) having a connection terminal (17) connected with a control semiconductor element (16) and arranged at a position exposed to the surface of an outer case (15), and a terminal electrode (18) for antenna connection connected with the control semiconductor element (16) and arranged in the outer case (15); a semiconductor storage element (12) mounted on one side of the wiring board (11); and a loop-like antenna (13) and an antenna terminal electrode (20) formed on the other side of the wiring board (11) along the outer peripheral thereof, the wiring board (11) includes at least one magnetic body layer (14) and the terminal electrode (18) for antenna connection is connected with the antenna terminal electrode (20).
Public/Granted literature
- US20090040734A1 SEMICONDUCTOR MEMORY MODULE INCORPORATING ANTENNA Public/Granted day:2009-02-12
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