Invention Grant
- Patent Title: Fluid displacement mechanism
- Patent Title (中): 流体位移机制
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Application No.: US12098957Application Date: 2008-04-07
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Publication No.: US08031408B2Publication Date: 2011-10-04
- Inventor: Timothy A. Large
- Applicant: Timothy A. Large
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Priority: GB0706748.1 20070405
- Main IPC: G02B1/06
- IPC: G02B1/06

Abstract:
A fluid displacement mechanism is disclosed. In an embodiment, first and second cavities are separated by a flexible membrane. The first cavity contains a non-conductive fluid and the second cavity contains a conductive fluid. First and second electrodes are positioned in the first and second cavities respectively such that the application of a voltage between the electrodes causes movement of the membrane by the build up of an electrostatic charge between the membrane and first electrode.
Public/Granted literature
- US20080257435A1 Fluid Displacement Mechanism Public/Granted day:2008-10-23
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